Advancing TGV Glass Interposers for Next-Gen High-Bandwidth Packaging

Through-glass via (TGV) technology is emerging as a key enabler for high-frequency and low-loss advanced packaging, addressing critical bottlenecks in high-bandwidth memory and chiplet integration for AI and high-performance computing systems. Traditional silicon interposers suffer from parasitic capacitance and high signal loss at high operating frequencies, while organic substrates cannot meet ultra-fine pitch interconnect requirements. Glass-based interposers with TGV structures feature low dielectric constant, excellent dimensional stability, and low signal attenuation, making them ideal for next-generation 2.5D and 3D packaging solutions. YURAY TECH has achieved major milestones in scaling TGV fabrication. Our proprietary laser drilling and metallization process delivers uniform, high-aspect-ratio glass vias with minimized sidewall roughness. The manufacturing flow is optimized for large-format glass panels, helping reduce per-unit cost while maintaining tight dimensional control across the entire panel. The company’s TGV glass interposer platform targets applications including AI accelerators, high-speed networking chips, and high-bandwidth memory modules. Ongoing work focuses on further reducing via diameter, improving thermal performance, and establishing mass-production readiness for customer prototyping and volume orders.