Applications
YURAY delivers integrated advanced-packaging technology solutions, combining silicon-based micro-bumping, TSV, and TGV capabilities across the full value chain—from material supply and wafer processing to metrology, testing, and final qualification.
OVERVIEW
By seamlessly integrating the complete semiconductor supply chain, YURAY delivers end-to-end, high-performance manufacturing solutions. Our core technology platform focuses on three advanced pillars: Silicon-based Micro-bumping, Through-Silicon Via (TSV) Technology, and Through-Glass Via (TGV) Technology. From customized material supply and full-scale fabrication to rigorous metrology and testing, our integrated capabilities ensure reliable, high-yield solutions perfectly tailored to the stringent demands of advanced microelectronics and 2.5D/3D heterogeneous integration.
[end-to-end service]
TGV Technology
Service Chain
01
Requirement MatchingUnderstanding customer application scenarios to define exact project needs.
02
Process DesignDesigning the customized workflow for target technical specifications.
03
Glass ProvisionSupplying glass substrates supporting sizes up to 510 × 515 mm.
04
Glass ThinningPhysically thinning glass down to 200 µm with ±15% tolerance.
05
Laser-Induced EtchingCreating minimum 30 µm vias using laser-induced etching technology.
06
AOI InspectionAutomated optical inspection evaluating via apertures and leakage rates.
07
Dummy Wafer ObservationAnalyzing via hole shapes and profiles on dummy wafers.
08
Roughness MeasurementMeasuring via sidewall roughness using specialized laser inspection tools.
09
Interlayer DepositionProprietary deposition withstanding 1000 thermal cycle testing (TCT) loops.
10
Cross-Cut TestingPerforming cross-cut tests to evaluate interlayer adhesion strength.
11
Seed Layer DepositionDepositing the copper seed layer for subsequent electroplating steps.
12
Copper ElectroplatingFilling the through-glass vias solidly with copper.
13
X-Ray InspectionScanning to accurately determine the electroplating via fill rate.
14
Surface Copper RemovalRemoving excess surface copper to planarize the glass substrate.
15
PVD ProcessingApplying Physical Vapor Deposition for subsequent metallization layers.
16
Frontside PatterningPatterning the redistribution layer (RDL) on the front surface.
17
Backside PatterningPatterning the redistribution layer (RDL) on the back surface.
18
DicingPrecision cutting of the glass substrate into individual dies.
19
Initial Electrical TestConducting preliminary electrical testing to verify TSV electrical connectivity.
20
TCT TestingPerforming Thermal Cycle Testing to assess thermo-mechanical reliability.
21
Final Electrical TestRe-testing electrical performance after thermal cycling to ensure stability.
22
Report & Customer ApprovalDelivering detailed inspection reports for client review and final confirmation.
23
Sample ShippingSecurely packaging and dispatching the finished samples to the client.
[end-to-end service]
TSV Technology
Service Chain
01
Requirement MatchingUnderstanding customer application scenarios to define exact project needs.
02
Process DesignDesigning the customized workflow for TSV fabrication.
03
Wafer ProvisionSupplying high-quality silicon wafers for TSV processing.
[end-to-end service]
Micro-bumping Technology
Service Chain
01
Process DefinitionDefining the complete manufacturing workflow for micro-bumping.
02
Mask Design & FabricationDesigning and manufacturing custom photomasks for precise patterning.
03
Wafer ProvisionSupplying high-quality silicon wafers for the bumping process.
04
Metal Layer DepositionDepositing essential metal base and seed layers.
05
Spin Coating & PatterningApplying and patterning photoresist for selective electroplating.
06
Electroplating ParametersAchieving 10 µm minimum diameter, 100 µm height, 10% uniformity.
07
Electroplating MaterialsProviding standard solder, Ni-Pd, Cu, and AgSn options.
08
Photoresist StrippingRemoving photoresist to form the final micro-bump structures.
09
Height MeasurementMeasuring bump height accurately using a confocal microscope.
10
AOI MeasurementUsing automated optical inspection to measure WID uniformity.
11
Cross-SectioningPerforming physical cross-sectioning for internal structural analysis.
12
D2D BondingExecuting precise Die-to-Die (D2D) micro-bump bonding processes.
13
IMC Layer ObservationUsing SEM/TEM on dummy wafers verifying IMC formation.
14
Push/Pull TestingConducting force tests to evaluate mechanical bond strength.
15
TCT TestingPerforming thermal cycle testing to assess bond reliability.
16
Failure AnalysisInvestigating and analyzing structural or functional component failures.
17
Report & Customer ApprovalDelivering detailed inspection reports for client review and final confirmation.
18
Sample ShippingSecurely packaging and dispatching the finished samples to the client.
[end-to-end service]
Optical Meta Surface Technology
Service Chain
01
Process DefinitionDefining the complete manufacturing workflow for optical metasurfaces.
02
Mask Design & FabricationDesigning and manufacturing custom photomasks for precise patterning.
03
Glass Substrate ProvisionSupplying high-quality glass substrates for metasurface fabrication.
04
Adhesion Layer DepositionDepositing an optimized adhesion layer for structural stability.
05
A-Si DepositionDepositing the amorphous silicon (a-Si) structural layer.
06
Peeling ObservationInspecting dummy wafers to assess adhesion and prevent peeling.
07
AFM Roughness TestTesting a-Si surface roughness using Atomic Force Microscopy.
08
Ellipsometry TestingMeasuring refractive index and extinction coefficient (n/k values).
09
Thickness UniformityAchieving a customized film thickness uniformity of 5%.
10
Cr PatterningCreating precise patterns using a Chromium (Cr) layer.
11
Programmable CuttingPrecision cutting of fabricated structures using programmable parameters.
12
Report & Customer ApprovalDelivering detailed inspection reports for client review and final confirmation.
13
Sample ShippingSecurely packaging and dispatching the finished samples to the client.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.