Laser Scanning Confocal Microscope (LSCM)
LSCM provides 3D surface profiling, height measurement, and micro-roughness analysis of patterned wafers, non-contact, for defect inspection.
Application Scenarios: 3D profiling, height measurement, surface roughness analysis.
Classic Standard: ISO 25178 / ASTM E1840.
Charging Standard: 500 RMB per hour.
OVERVIEW
YURAY provides laser scanning confocal microscopy services for high-magnification, non-contact 3D surface topography and profile measurement. Combining confocal optics with up to 3600× magnification, our platform captures precise 3D surface data for bump profiles, step heights, surface roughness, and micro-feature geometry. We support non-destructive measurement of advanced packaging structures with nanometer-level Z resolution and full-field 3D visualization.
SERVICES
Our laser scanning confocal platform enables high-resolution non-contact 3D metrology — supporting bump profiling, step-height measurement, and surface topography analysis with excellent accuracy and repeatability.
3D Surface Topography & Roughness
Non-contact 3D surface topography and roughness measurement using confocal laser scanning — enabling full-field surface reconstruction and quantitative roughness characterization of polished, coated, and patterned surfaces.
| Parameter | Specification |
|---|---|
| Max. Magnification | 3600× |
| Z Resolution | ≤ 10 nm |
| Measurement Mode | Non-contact 3D |
| Roughness Parameters | Ra, Rq, Rz, Rmax |
| Field of View | Up to 5 × 5 mm (stitched) |
| Sample Types | Si, glass, films, metals |
| Wafer Size | 4 / 6 / 8 / 12 inch |
Step-Height & Bump Profile Measurement
Precise non-contact measurement of step heights, bump profiles, and micro-feature geometry — enabling accurate 3D characterization of Cu pillars, solder bumps, and patterned structures for advanced packaging quality control.
| Parameter | Specification |
|---|---|
| Step Height Range | 10 nm – 1 mm |
| Height Accuracy | ≤ 0.5% of height |
| Bump Size Range | ≥ 5 μm |
| Bump Types | Cu pillar, solder, micro-bump |
| Profile Output | 3D profile + cross-section |
| Measurement Speed | ≤ 10 sec per site |
| Output | 3D data + dimensional report |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven confocal characterization results.
Cu Pillar / Bump 3D Profile Measurement
- Confocal 3D profile measurement per bump
- Sample Supply — 8-inch Cu pillar wafer (3 units), incoming inspection and sample preparation
- 3D profile extraction and analysis
- Multi-point measurement across wafer
- Analysis — 3D rendering and cross-section extraction
- Metrology — 3x repeat measurement per site
- 3 wafers received & logged
- Average height: 50.3 μm
- Diameter: 25.1 μm, shape verified
- Uniformity: 3.2% (within wafer)
- 3D profiles delivered
- Repeatability: < 0.1 μm
- 3D data, profiles, and analysis consolidated
- Final characterization report delivered
Surface Topography & Micro-Defect Analysis
- Confocal 3D roughness measurement
- Sample Supply — 6-inch glass substrate (patterned), incoming inspection and sample preparation
- Non-contact step-height profiling
- High-magnification 3D scanning
- Analysis — Full-field surface reconstruction
- Metrology — 9-point measurement across sample
- 6-inch glass supported
- Ra: 0.6 nm average
- Step height: 2.05 μm measured
- Micro-defects detected & mapped
- 3D topography maps delivered
- Uniformity data delivered
- 3D maps, profiles, and data integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.