Testing & Analysis
Mechanical, environmental, and electrical testing — salt spray, high-temperature, tensile, peel strength, and Kelvin resistance — validating long-term performance and bond integrity.
OVERVIEW
YURAY provides comprehensive full-chain manufacturing and engineering services, ensuring the highest quality standards for your semiconductor and micro-device needs. At the core of our full-chain approach is our advanced reliability testing suite. Testing is not merely a final checkpoint; it is a critical verification step for both manufacturing processes and end-use applications. By integrating rigorous environmental, mechanical, and electrical testing, we seamlessly connect back-end test results to front-end manufacturing. This crucial link allows us to perform in-depth failure analysis, accurately identify potential defects or issues in early-stage front-end processes, and implement data-driven process optimizations. Ultimately, this ensures superior structural endurance and long-term product performance. Furthermore, while we excel in providing complete end-to-end solutions, YURAY remains highly flexible. We proudly offer all of our specialized reliability and measurement capabilities as standalone testing services, fully customizable to meet your specific independent project requirements.
SERVICES
Salt Spray Testing / Salt Fog Testing
Salt fog corrosion testing evaluates anti-corrosion performance of metal coatings on wafers under harsh salt-laden atmospheric conditions.Classic Standard: ASTM B117 / ISO 9227.Charging Standard: Quoted per sample quantity and test duration. Please contact YURAY for pricing.
High-Temperature Testing
High-temperature testing assesses thermal reliability and structural endurance of MEMS and wafer substrates under elevated temperatures.Classic Standard: JEDEC JESD22-A104 / IEC 60068-2-2.Charging Standard: 50 RMB per hour
Tensile Testing / Pull Testing
Tensile and pull testing measures bonding strength of thin films on wafers, quantifying force to break bonds under mechanical stress.
Peel Testing / Peel Strength Testing
Peel strength testing measures film-to-substrate adhesion, verifying bonding quality and layer durability for microelectronic and MEMS components.
Kelvin Resistance Measurement
Kelvin four-point probe measurement provides accurate low-resistance readings for metal traces on wafers, eliminating contact resistance errors.
Precision Probe Testing / Precision Probe Measurement
Precision probe station testing performs detailed electrical characterization of micro patterns and MEMS wafers for device performance and defect evaluation.
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.