High-Temperature Testing
High-temperature testing assesses thermal reliability and structural endurance of MEMS and wafer substrates under elevated temperatures.
Application Scenarios: Thermal reliability testing, heat aging, structural endurance verification.
Classic Standard: JEDEC JESD22-A104 / IEC 60068-2-2.
Charging Standard: 50 RMB per hour
OVERVIEW
High-temperature testing assesses thermal reliability and structural endurance of MEMS and wafer substrates under elevated temperatures.
SERVICES
Our high-temperature platform enables controlled, repeatable thermal-stress testing across wafers, packages, and panels — supporting unbiased storage and biased operating-life evaluation with in-situ monitoring.
High-Temperature Storage (HTS)
Unbiased high-temperature storage testing per JEDEC JESD22-A103 to accelerate thermally-driven degradation — enabling reliability screening of interconnects, metallization, and packaging materials.
| Parameter | Specification |
|---|---|
| Test Standard | JEDEC JESD22-A103 |
| Temperature Range | 125 – 300 °C |
| Temperature Stability | ± 1 °C |
| Soak Duration | 24 – 1,000 h |
| Atmosphere | Air / N₂ |
| Sample Types | Wafers, packages, panels |
| Output | Pre/post characterization |
High-Temperature Operating Life (HTOL)
Biased high-temperature operating life testing per JEDEC JESD22-A108 to evaluate device reliability under combined electrical and thermal stress — enabling lifetime estimation and degradation analysis.
| Parameter | Specification |
|---|---|
| Test Standard | JEDEC JESD22-A108 |
| Temperature Range | 125 – 175 °C |
| Bias Conditions | Programmable V / I |
| Temperature Stability | ± 1 °C |
| Test Duration | 168 – 1,000 h |
| Monitoring | In-situ electrical |
| Output | Degradation data |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven high-temperature testing results.
HTS Reliability Qualification of Cu Pillar Interconnects
- Programmed exposure and monitoring
- Sample Supply — Incoming inspection and die selection
- Test Setup — Chamber setup and calibration
- Pre/Post — Measurement before / after exposure
- Analysis — Cross-section and SEM analysis
- Evaluation — Rating and documentation
- 12-inch wafer supported
- Temperature verified
- 1,000 h exposure completed
- Data captured
- IMC growth within limit
- PASS — within acceptance criteria
- Data and images integrated
- Final characterization report delivered
High-Temperature Stability of TGV Metallization
- Programmed exposure and monitoring
- Sample Supply — Incoming inspection and sample preparation
- Test Setup — Chamber setup with inert atmosphere
- Pre/Post — Measurement before / after exposure
- Analysis — SEM and optical inspection
- Evaluation — Rating and documentation
- TGV panel supported
- Atmosphere verified
- 500 h exposure completed
- Resistance shift < 5%
- No delamination observed
- PASS — within acceptance criteria
- Data and images integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.