Automated Optical Inspection (AOI)
AOI performs high-speed pattern defect detection, particle inspection, and dimensional measurement on microfabricated substrates for non-contact quality control.
Application Scenarios: Pattern defect inspection, particle detection, dimensional test.
Classic Standard: IPC-A-610 / SEMI G86.
Charging Standard: 2,000 RMB per hour.
OVERVIEW
YURAY provides automated optical inspection (AOI) services for high-speed surface defect detection across wafers, packages, and advanced packaging structures. Our AOI platform combines high-resolution optics with automated image processing to detect particles, scratches, residue, pattern defects, and bump anomalies with full-wafer coverage. Defects are automatically classified, mapped, and reported with yield statistics — supporting incoming quality inspection, process monitoring, and outgoing quality assurance.
SERVICES
Our AOI platform enables automated, high-throughput inspection with reliable defect detection and classification — supporting wafer-level and package-level quality control across the full production flow.
Wafer Surface Defect Inspection
Automated optical inspection of wafer surfaces for particles, scratches, residue, coating defects, and pattern anomalies — with automated defect classification, coordinate mapping, and yield reporting.
| Parameter | Specification |
|---|---|
| Defect Detection | ≥ 0.5 μm |
| Wafer Coverage | 100% full-surface |
| Defect Types | Particles, scratches, residue, pattern |
| Classification | Automated AI-assisted |
| Output | Defect map + yield report |
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Throughput | Up to 60 wafers/hour |
Package & Bump AOI
Automated optical inspection of packages, bumps, and RDL structures for missing bumps, bridging, shape anomalies, and surface defects — supporting advanced packaging quality control at wafer and die level.
| Parameter | Specification |
|---|---|
| Bump Detection | ≥ 10 μm bump size |
| Defect Types | Missing, bridging, shape, residue |
| Inspection Modes | 2D top-view + 3D profile |
| Bump Types | Cu pillar, solder bump, micro-bump |
| Output | Defect map + bin data |
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Throughput | Up to 30 wafers/hour |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven AOI inspection results.
Wafer-Level Defect Inspection & Mapping
- AOI full-surface scanning at high resolution
- Sample Supply — 12-inch patterned wafer (5 units), incoming inspection and wafer registration
- Full-wafer scan with no sampling
- Analysis — AI-assisted defect binning by type
- Analysis — Coordinate-level defect map generation
- Metrology — Per-wafer and per-die yield calculation
- 5 wafers received & logged
- Defects ≥ 0.8 μm detected
- 100% coverage achieved
- Classification accuracy > 95%
- Full defect maps delivered
- Yield report delivered
- Defect maps, images, and yield data consolidated
- Final inspection report delivered
Bump & RDL AOI for Advanced Packaging
- 2D + 3D AOI inspection
- Sample Supply — 8-inch Cu pillar wafer (3 units), incoming inspection and sample preparation
- 3D profile measurement per bump
- Analysis — Automated binning of bump defects
- Analysis — High-resolution pattern defect scanning
- Metrology — Wafer-level defect map generation
- 3 wafers received & logged
- All bump anomalies detected
- Height uniformity: ± 3%
- Per-bump bin data delivered
- RDL defects detected & mapped
- Defect maps + statistics delivered
- Images, bin data, and analysis consolidated
- Final inspection report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.