Photolithography
YURAY delivers precision photolithography services for semiconductor and advanced-packaging applications. With double-sided UV lithography, DUV lithography, projection steppers, and step-and-scan systems
OVERVIEW
Yuray provides precision wafer patterning services through a comprehensive photolithography platform. Our capabilities include double-side UV lithography, mask aligners, projection steppers, and step-and-scan lithography systems, supported by integrated coating, baking, developing, plasma cleaning, and HMDS priming processes. We support standard photolithography flows for 4-, 6-, 8-, and 12-inch wafers, as well as selected glass and advanced-packaging substrates. From large-area alignment and thick-photoresist processing to fine-pitch redistribution and bump patterning, Yuray provides process solutions for semiconductor, TSV, TGV, and micro-bumping applications.
SERVICES
Yuray provides integrated photolithography processing from substrate preparation through pattern inspection. Process routes are selected according to feature size, resist thickness, substrate material, surface topography, alignment requirement, and the subsequent etching, deposition, electroplating, or lift-off process.
Contact Aligner
Contact and proximity UV lithography for large-feature patterning, thick photoresist processing, and rapid prototyping. Supports double-side alignment for wafer-level packaging and MEMS applications.
| Parameter | Specification |
|---|---|
| Resolution | 800 nm |
| Overlay Accuracy | 500 nm |
| Wafer Size | 4 / 6 / 8 inch |
| Resist Thickness | 1 – 20 µm (thick resist) |
| Alignment Mode | Double-side / single-side |
| Typical Application | Plating molds, thick resist, rapid prototyping |
Project Stepper
| Parameter | Specification |
|---|---|
| Resolution | 100 – 350 nm |
| Overlay Accuracy | < 30 – 100 nm |
| Wafer Size | 4 / 6 / 8 inch |
| CD Uniformity | < 30 – 50 nm |
| Lithography Mode | Projection stepper / step-and-scan |
| Typical Application | Fine-pitch RDL, bump patterning, multilayer lithography |
Step-and-Scan Lithography
| Parameter | Specification |
|---|
CASE STUDY
At YURAY, we provide precision photolithography patterning services across wafers and glass substrates — from mask design and spin coating to development and inspection, delivering fine-feature patterns tailored to your device requirements.
Fine-Pitch Patterning on Glass
RDL Patterning on 8-inch Silicon
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.